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Projets

Call 8

R&D

HIPAC

The aim of the HIPAC project is to develop new high-temperature encapsulation technologies for power electronic components, e.g., welding or fritting chips or substrates and silicone gels to protect chips.

The components will be based on the new high-speed semiconductor arrays of silica carbide (SiC) and gallium nitride (GaN), which function at extreme temperatures with low switching losses.

These arrays make it possible to increase the energy efficiencies of power conversion systems and reduce the weight of onboard convertors in aeronautics (more electric planes), the automotive industry (electric and hybrid vehicles), and trains (traction inverter and auxiliary convertors).

Markets

Industry

Technology

Sensors
Advanced and Active Materials and Surfaces

Consortium